Peacock AIEcosystem
Standard Guides:WeldingPipingASMEAPIAsset Matrix
Computed Radiography
🐘 Tusker VaultRadiographyRadiographic • CR

Computed Radiography (CR)

Method Overview

Filmless radiography utilizing photostimulable phosphor imaging plates to capture and digitize internal component geometry.

Core Method Specifications

Technique IDCR
AcronymCR
CategoryRadiography
ModalityRadiographic
Standardized Report TemplateISO 17020 Ready
CR-Standard-TemplateTest in Sandbox

Target Applications & Governing Standards

1 Scopes Configured
Valves & Pressure Control
API 598 ASME Sec V
Target Assets / Components:
In-Service Valve AssembliesSmall Bore Bypass Piping
Detectable Defects & Anomalies:
• Internal Erosion• Debris Blockage• Disc Erosion

Method Limitations & Operational Boundary Conditions

Critical physics limits, thermal envelopes, blind spots, and ASME Sec V / API procedural boundaries for CR.

Level III Procedure Control
Operating Temp Envelope
Standard Envelope-20°C to +50°C (-4°F to 122°F) for phosphor storage imaging plates (IP)
High-Temp CapabilityComponent can be hot (> 250°C) if insulated standoff cassettes prevent IP temperature from exceeding 50°C

Latent image fading occurs rapidly on imaging plates if exposed to heat (> 40°C) or prolonged ambient light.

Thickness & Dead Zone
Min Thickness0.8 mm (0.03 in) with fine grain phosphor plates
Max RangeUp to 65 mm (2.5 in) with Ir-192; up to 120 mm with Co-60 or high-voltage X-ray
Near-Surface Dead Zone

Zero physical dead zone

Surface Condition & Couplant
Roughness & PrepWeld surface roughness should not obscure digital contrast density resolution
Coating ToleranceUniform coatings do not interfere; heavy lead-based primers increase radiation attenuation
Geometry & Orientation
Orientation Sensitivity

Planar flaws must align within ±5° of radiation beam axis for acceptable contrast threshold

Clearance:Radiation exclusion perimeter barricade required
Critical Blind Spots
  • •Tight planar lack of sidewall fusion oriented off-axis from beam vector
  • •Laser scanner optical artifacts (laser jitter, scan line dropout) mimicking linear discontinuities
False Indication Trap:

Scratches, dust particles, and cracked protective laminate on reusable phosphor plates

Recommended Cross-Validation
PAUTView Method

Comprehensive weld inspection to verify planar bevel fusion and determine through-wall depth

UTView Method

Direct thickness verification on areas showing radiographic density loss

Level III Code Compliance Directive:ASME Section V Article 2 Mandatory Appendix II mandates measuring basic spatial resolution (SRb) using duplex wire IQIs and scanning plates within 4 hours.

Technique-to-OEM Compatibility Matrix

Verified manufacturers, instrument models, and diagnostic portals supporting CR.

5 Verified OEMs
Waygate Technologies

Waygate Technologies

Global industrial inspection conglomerate under Baker Hughes, encompassing Krautkrämer ultrasonic, Seifert radiography, Everest borescopes, and phoenix|x-ray computed tomography.

Modalities:UTRTETCRDR+3 more
OEM Profile Waygate Service Hub
OEM Site
Carestream NDT

Carestream NDT

Global benchmark for digital radiography systems, computed radiography (CR) phosphor imaging plates, and high-contrast industrial NDT films (formerly Kodak NDT).

Modalities:RTCRDR
OEM Profile Carestream NDT Support
OEM Site
Dürr NDT

Dürr NDT

German pioneer of computed radiography (CR) laser scanners, high-resolution digital detector arrays (DR flat panels), and D-Tect X radiographic evaluation software.

Modalities:CRDRRT
OEM Profile Dürr NDT Support
OEM Site
GE HealthCare

GE HealthCare

Global enterprise medical imaging innovator manufacturing clinical Micro-CT systems, high-frequency ultrasonic diagnostic transducers, and hospital radiological assemblies.

Modalities:CTUTRTCRDR
OEM Profile GE HealthCare Support Portal
OEM Site

KUBTEC

OEM Manufacturer for CR inspection systems.

Verified Partner
ASME Sec V & ISO 9712 Qualified
Rent CR Instruments OEM Hardware CatalogPost CR Project Scope